Introduction of company. Established in 2003, the Singapore based company was initially setup to provide automation services in terms of design, development & manufacturing to the various leading industries in the market. From this humble background, the company has since grown to cater to the needs of a wider range of products & a broader group of various industry customer's both locally, regionally as well as in Europe.

2005 proved to be an important milestone for the company. With the introduction of an in-line Trim & Form coupled to a Solder Dipping System for the Semiconductor Backend packaging, the company has breakthrough the traditional bonds & linkages of the backend packaging cycle. Reducing the needs of product handling thus increasing the yield & productivity of these conventional processes.